Cooler Master TD500 Mesh, Mid-Tower

Product Information

Prior to load testing, we collect idle temperature results for ten minutes to determine the unloaded cooling performance of a case's fans and air channels. Thermal benchmarking is conducted for 1400 seconds (23 minutes), a period we've determined sufficient for achieving equilibrium. The over-time data is aggregated and will occasionally be compiled into charts, if interesting or relevant. The equilibrium performance is averaged to create the below charts. Installing a system into the Cooler Master MasterBox TD500 V2 is a simple and pleasing process. Cooler Master has everything laid out in the correct positions, everything is where you would expect it to be. Alignment of PCIe slot cutouts, motherboard standoffs and fan screw holes etc are all good, nothing was difficult to install due to alignment issues, which can be a problem on some cheap chassis.

The narrow case design also means that users could run into space issues with some new Nvidia RTX 40 series cards. There is only 175mm space between the motherboard standoffs and the TG side panel. Our test system card measures 140mm wide, when installed and connected to PCIE cables there isn’t much gap to the side panel. A wider RTX 40 card using a 12VHPWR adaptor cable could be pushing the case limits and the cable could be trapped against the side panel. With the GPU loaded instead, GPU temperature reached 22 degrees over ambient. This is tied with the SL600M and Lian Li O11 XL for best GPU temperature overall on the whole chart, both of which were tested with bottom intake fans pointed directly into the GPU. Without the full-system load of the torture test, GPU cooling is especiallly good, which is promising for the Firestrike Extreme result. Firestrike Appearances were a top priority in the design of the TD500 Mesh: there are some areas where pennies have been pinched, and other areas where those pennies have been reinvested. We’ll start with the cost savings for contrast. The chassis itself is a design intended for reuse, which isn’t unusual or even bad, but it’s easy to tell from the vestigial remains of a 5.25” bay at the front of the case. We confirmed with Cooler Master that this body was an original creation for the TD500; the chassis will be reused for future cases, some of which may have ODD support--optical drives remain popular in the Japanese market, for example.Firestrike is next, our gaming stand-in. The TD500 Mesh isn’t at the absolute top of the chart here, but it’s pretty close. 49C dT ties it with the P400A Mesh and gets it pretty close to the O11 XL again, although the larger temperature range reveals the SL600M’s advantage with an average of 46C dT. The 500DX averaged 53C dT in this test, giving the TD500 Mesh a slightly larger advantage than it had in the torture results. Standardized Fans As usual with case noise testing, removing the side panel lowers noise since the fan RPM is reduced due to the cooler temperature of the components. With the case in its default configuration noise output was measured at 51dBA which could become a little distracting for some users. Manually tuning the fan curve may be required to keep noise output more comfortable. Closing Thoughts MCB-D500D-KGNN-S01 (Mesh w/ Hub), MCB-D500D-KGNN-S00 (Mesh w/o controller), MCB-D500D-WGNN-S01 (Mesh White w/ Hub), MCB-D500D-WGNN-S00 (Mesh White w/o controller) All temperature measurements are presented as Deltas – meaning the ambient temperature has been deducted from the CPU temperature giving us a Delta. Data shown in the charts represent the average component temperature over the length of the test as measured by HWiNFO and then the last 15 minutes of the data are calculated to get the average. The ambient temperature during thermal tests is between 20-22⁰C. Find our noise normalized & fan normalized testing methodology here: https://www.gamersnexus.net/guides/3477-case-fan-standardization-tests-noise-normalized-thermals Thermals & Noise

Cable management space is tight behind the motherboard tray. Cooler Master lists clearance as 1.9mm, but that’s the maximum depth, and in some locations clearance shrinks towards 1.5mm. The tie points next to the cable cutouts and the space under the PSU shroud make management possible, but the small amount of clearance combined with the already difficult-to-wrangle steel side panel aren’t fun to deal with. Load testing is conducted using Prime95 LFFTs and Kombustor “FurMark” stress testing simultaneously. Testing is completely automated using in-house scripting, and executes with perfect accuracy on every run. Mini ITX, Micro ATX, ATX, SSI CEB, E-ATX*, (*up to 12" x 10.7" motherboards, may impact cable management feature) To simulate thermal demand we run the Cinebench R23 multi-thread benchmark and 3DMark Time Spy Extreme stress test simultaneously in a loop for 60 minutes to fully load the system. This gives the CPU and GPU enough time to reach constant steady-state temperature. With this data, we can compare how the system handles the thermal demand and measure peak noise levels.Added support for USB Type C front connection with a USB 3.2 Gen 2 Type C port alongside two USB 3.0 Type-A ports now on the front panel. The original TD500 Mesh had only USB Type-A front panel ports. To look at the TD500 Mesh V2 you could easily mistake it for the original. In terms of the visuals not much has changed at all. It still has the Polygonal FineMesh front panel design, it comes with three CF120 ARGB fans pre-installed up front and features the Crystalline tempered glass side panel like the original. But there have been some subtle changes, the case is a little taller, the top panel is now removable, there's a cover for the PSU shroud window and USB type-C has been added to the front I/O panel.