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Materials Science of Thin Films: Depositon and Structure

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Chapter 5 Plasma and Ion Beam Processing of Thin Films 5.1. Introduction 5.2. DC, AC, and Reactive Sputtering Processes 5.3. Magnetron Sputtering 5.4. Plasma Etching 5.5. Hybrid and Modified PVD Processes 5.6. Conclusion Exercises References

Great for oil and grease-laden applications. These gaskets offer good resistance to ozone, ageing and are low gas permeable with great temperature prevail. Nitrile O RingsChapter 2 Vacuum Science and Technology 2.1. Introduction 2.2. Kinetic Theory of Gases 2.3. Gas Transport and Pumping 2.4. Vacuum Pumps 2.5. Vacuum Systems 2.6. Conclusion Exercises References Chapter 1 A Review of Materials Science 1.1. Introduction 1.2. Structure 1.3. Defects in Solids 1.4. Bonds and Bands in Materials 1.5. Thermodynamics of Materials 1.6. Kinetics 1.7. Nucleation 1.8. An Introduction to Mechanical Behavior 1.9. Conclusion Exercises References This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added. Great for hot and cold water, steam and grease-laden applications. These gaskets are low cost and, with certain grades of EPDM, available for use in applications where temperatures exceed 180 degrees. FKM O Rings

Chapter 7 Substrate Surfaces and Thin-Film Nucleation 7.1. Introduction 7.2. An Atomic View of Substrate Surfaces 7.3. Thermodynamic Aspects of Nucleation 7.4. Kinetic Processes in Nucleation and Growth 7.5. Experimental Studies of Nucleation and Growth 7.6. Conclusion Exercises References Chapter 6 Chemical Vapor Deposition 6.1. Introduction 6.2. Reaction Types 6.3. Thermodynamics of CVD 6.4. Gas Transport 6.5. Film Growth Kinetics 6.6. Thermal CVD Processes 6.7. Plasma-Enhanced CVD Processes 6.8. Some CVD Materials Issues 6.9. Safety 6.10. Conclusion Exercises ReferencesChapter 8 Epitaxy 8.1. Introduction 8.2. Manifestations of Epitaxy 8.3. Lattice Misfit and Defects in Epitaxial Films 8.4. Epitaxy of Compound Semiconductors 8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films 8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films 8.7. Mechanisms and Characterization of Epitaxial Film Growth 8.8. Conclusion Exercises References

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