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Jackson Industries 1.85 Oz Just For Copper Solderless Copper Bonding JFC050

£15.415£30.83Clearance
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Burns, J.A., Aull, B.F., Chen, C.K., Chen, C.L., Keast, C.L., Knecht, J.M., Suntharalingam, V., Warner, K., Wyatt, P.W., Yost, D.R.W.: A wafer-scale 3-D circuit integration technology. IEEE Trans. Electron. Dev. 53(10), 2507–2516 (2006). https://doi.org/10.1109/TED.2006.882043

begin{align*} \sum \chi &= \dfrac{\chi_A + \chi_B}{2} \\[4pt] &=\dfrac{2.18 + 2.22}{2} \\[4pt] &= 2.2 \end{align*}\] USGS: Copper: Very useful statistical data on US and world copper mining and production from the US Geological Survey. Kang, Q., Wang, C., Zhou, S., Li, G., Lu, T., Tian, Y., He, P.: Low-temperature co-hydroxylated Cu/SiO 2 hybrid bonding strategy for a memory-centric chip architecture. ACS Appl. Mater. Interfaces 13(32), 38866–38876 (2021). https://doi.org/10.1021/acsami.1c09796 China's Slowdown Tarnishes Economic Boom in Copper-Rich Zambia by Norimitsu Onishi. The New York Times, December 2, 2015. How China's attempted shift from manufacturing and production to services and consumption is affecting commodity-producing nations in Africa.Kim, S., Kang, P., Kim, T., Lee, K., Jang, J., Moon, K., Na, H., Hyun, S., Hwang, K.: Cu microstructure of high density Cu hybrid bonding interconnection. In: IEEE 69th ECTC, pp. 636–641 (2019). https://doi.org/10.1109/ECTC.2019.00101 Gao, G., Mirkarimi, L., Workman, T., Fountain, G., Theil, J., Guevara, G., Liu, P., Lee, B., Mrozek, P., Huynh, M., Rudolph, C., Werner, T., & Hanisch, A.: Low temperature Cu interconnect with chip to wafer hybrid bonding. In: IEEE 69th ECTC, pp. 628–635 (2019). https://doi.org/10.1109/ECTC.2019.00100

Juang, J.Y., Lu, C.L., Chen, K.J., Chen, C.C.A., Hsu, P.N., Chen, C., Tu, K.N.: Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient. Sci. Rep. 8(1), 1–11 (2018). https://doi.org/10.1109/IMPACT.2017.8255959 Cuprous halides with fluorine, chlorine, bromine, and iodine are known, as are cupric halides with fluorine, chlorine, and bromine. Attempts to prepare copper(II) iodide yield only copper(I) iodide and iodine. [59] 2 Cu 2+ + 4 I − → 2 CuI + I 2 Coordination chemistry Copper(II) gives a deep blue coloration in the presence of ammonia ligands. The one used here is tetraamminecopper(II) sulfate. Panigrahi, A.K., Ghosh, T., Vanjari, S.R.K., Singh, S.G.: Oxidation resistive, CMOS compatible copper based alloy ultrathin films as a superior passivation mechanism for achieving 150 °C Cu–Cu wafer on wafer thermocompression bonding. IEEE Tans. Electron Dev. 64, 1239–1245 (2017). https://doi.org/10.1109/TED.2017.2653188 Kang, Q., Li, G., Li, Z., Tian, Y., Wang, C.: Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO 2 hybrid bonding. J. Mater. Sci. Technol. 149, 161–166 (2023). https://doi.org/10.1016/j.jmst.2022.12.012 Characteristics Physical A copper disc (99.95% pure) made by continuous casting; etched to reveal crystallites Copper just above its melting point keeps its pink luster color when enough light outshines the orange incandescence color.Liu, C., Lin, H., Huang, Y., Chu, Y., Chen, C., Lyu, D., Chen, K., Tu, K.: Low-temperature direct copper-toc-opper bonding enabled by creep on (111) surfaces of nano-twinned Cu. Sci. Rep. 5, 09734 (2015). https://doi.org/10.1038/srep09734 A variety of adhesive types readily bond copper and its alloys. Many prefer adhesives over soldering as adhesives do not heat damage the copper. Anaerobics Zhang, S., Wang, Q., Lin, T., Zhang, P., He, P., Paik, K.W.: Cu–Cu joining using citrate coated ultra-small nano-silver pastes. J. Manuf. Process. 62, 546–554 (2021). https://doi.org/10.1016/j.jmapro.2020.11.043

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