ARCTIC MX-6 (4 g) - Ultimate Performance Thermal Paste for CPU, consoles, graphics cards, laptops, very high thermal conductivity, long durability, non-conductive, non-capacitive

Product Information

Here is a statement from ARCTIC about MX-6. “With its improved composition, the ARCTIC MX-6 has a measurably lower thermal resistance than the MX-4. The basis for calculation is the temperature difference between the cooler base and the heat source (in C) in relation to the applied heat load (in W), which also results in the unit C/W. The higher the thermal resistance, the worse the heat can be transferred through the TIM layer. Thermal insulators, as an example, therefore always have a particularly high thermal resistance, while thermal interface materials usually have a particularly low one.”

Now coming to the main point of this article, the following configuration is used for thermal paste testing: –

Thermal paste for processor (4 grams)

The wipe is made of 100% Limonene extracted from citrus essential oil. This would mean that these wipes don’t have alcohol or benzenes as this substance is used in industrial applications for cleaning as it is effective and gentle on metals and alloys. Arctic's MX-5 did not replace the MX-4 and the two pastes continued to co-exist up until recently, even though the new one often performed better than its predecessor. By contrast, the MX-6 actually replaces the MX-5.

The XTM50 paste by itself has low viscosity, so can also just use the 'Dot method' to apply the paste and let the mounting pressure do its thing. But if you're too worried about applying using that method, then the bundled stencil and spreader make it very easy to get things done. In theory, you can use any application method for a compound with low viscosity, but the stencil makes it that much easier to apply. It's for new builders who don't necessarily have the technical know-how of properly applying thermal paste and how improper application can have a lasting impact on the overall performance of the CPU. Thermal compounds might always be compared and debated over, but the simple fact remains: PC system building needs thermal compounds to effectively dissipate thermal loads. Without them, our beloved gaming and content-producing machines would struggle to keep components cool during heated frag sessions, heavy workstation computations, or just simply browsing the web. We tested each thermal paste with a low-tension air cooler mount, high-tension air cooler mount, and a high-tension AIO liquid cooler mount. Each application was given a 1-hour burn-in using Prime95 with ten load and cooling cycles over the course of the hour; six minutes each with a ten-second cool-down between. Each testing load session was then executed for a one-hour load period, again using Prime95. For a compound that costs less than half as much as leading competitors , Phobya's Liquid Metal Compound LM offers impressive performance, often besting the the CoolLaboratory Liquid Pro or Thermal Grizzly Conductonaut in our tests. In contrast, traditional thermal paste compounds are relatively simple for every experience level. Most, but not all, traditional pastes are electrically non-conductive.

Throw Your Computer In The Ocean.

We're also putting a new take on an old approach to the test — thermal pads. These pads can be used as TIM and come as a single sheet you simply apply to your heatsink, with Thermaltake's Heilos Pad being the first new thermal pad entrant to see our test bed in the coming weeks. Thanks to improved composition, the MX-6 has a measurably lower thermal resistance and achieves up to 20% better performance. It achieves this without reputed ingredients like expensive diamond dust or various precious metals. The dispersion is quite good, denoting that it is not as viscous as it seemed to us in the first instance, especially when we have not applied as much pressure as a heatsink will apply to the processor and, in fact, we have put much more thermal paste on the paper of the which we will cast on the IHS of the processor normally. Thermal paste syringes have the same appearance as the vast majority of these products, of course with their identification label and with a cap that is pressured and not screwed.

On top of that, liquid metals can't be used with aluminum heat sinks since the Gallium in them reacts with aluminum. That's not really an issue since most heat sinks (remember, not all) are made of copper which is nonreactive with the liquid metal. That being said, the high risk pays off in meaningful ways the liquid metal provides up to 73 W/(mK) thermal conductivity. It's much higher than the 0.5-12.5 W/(mK) thermal conductivity provided by conventional thermal pastes. For the air cooling low- and high-tension tests, we used a large Noctua NH-D15 air cooler. We created the low tension mount environment by torquing the mounting screws to 1.13 Nm (10 in/lbs).In terms of specifications, the Cooler Master MasteGel Regular thermal paste has a thermal conductivity of 5 W/mk, which is more in line with a lot of other options mentioned in this collection. The company also sells a premium version of this particular paste with thermal conductivity of 11 W/mk. This paste is grey in color and its density is 2.5 g. We had absolutely no issues applying the paste on the CPU. The overall performance of the solution has also been pretty solid as we've encountered no abnormalities in the CPU temps. We've used this particular paste for many of our builds and it's been a reliable option. Small differences in temperatures jostle the chart a bit, but overall the more budget-friendly compounds show much more promising performance value due to relatively close load ranges. We see a trend that most good and great thermal compounds perform very similarly, but might be worlds apart in price per gram. It’s no surprise that the liquid metal compounds once again sit atop the thermal comparison. Still, a 6C difference between all 15 thermal compounds tested shows there isn’t a lot of variation, even with a 360 all-in-one cooler with a push+pull fan setup for performance. Please note that not every run of the stress test may yield the same result. This could well be due to many factors like mounting pressure, thermal paste application, and varying ambient temperature. Not to mention the silicon differences even among the same category of chips. Hence, it is pertinent to mention the testing methodology along with the specifics. Each time the even spread of the thermal paste was verified and where the thermal paste spread was not even or gives the impression of a tear or a poor application, the result was dropped and the new test with correct spread was repeated. This is done to ensure the validity of the data. Liquid metal compounds make their way to the top of the temperature chart with slightly cooler values than the traditional pastes. Interestingly, the difference between the top and bottom of this chart is less than 4C.